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  Datasheet File OCR Text:
  SPEC NO :
SPECIFICATION
CUSTOMER PRODUCT MODEL NO PREPARED APPROVED
SAW FILTER HDBF21101A24
CHECKED D A T E
CUSTOMER RECEIVED:
CHECKED
APPROVED
DATE
Shoulder Electronics Limited
www.shoulder.cn
Tel:0755-82916880
Fax:0755-82916881
E-mail:info@shoulder.cn
Page 1 of 6
SAW FILTER
HDBF21101A24
History Record
Date Spec No Part No Customer No Modify Content Remark
www.shoulder.cn
Tel:0755-82916880
Fax:0755-82916881
E-mail:info@shoulder.cn
Page 2 of 6
SAW FILTER
HDBF21101A24
1. SCOPE
This specification shall cover the characteristics of SAW filter with the page system. HDBF21101A24 used for
2. ELECTRICAL SPECIFICATION
Maximum incident power in passband Max.DC voltage between any 2 terminals Storage temperature range Operation temperature range Suitable for lead-free soldering-Max.soldering profile +10dBm 30VDC -40 to +85 -10 to +85 260 for 30s
Electronic Characteristics
Parameter Center Frequency Insertion Loss 3dB Bandwidth f0-2.0 to f0-1.05 and f0+1.05 to f0+2.0MHz f0-80 to f0-2.0 and f0+2.0 to f0+80MHz nxf0 over 291 to 2000MHz Group Delay Variation overf0150KHz Frequency Temperature coefficient Minimum 450 10 30 40 Typical 211.0 7 500 21 33 60 200 0.32 Maximum 8 250 Unit MHz dB KHz dB dB dB nsec ppm/C
www.shoulder.cn
Tel:0755-82916880
Fax:0755-82916881
E-mail:info@shoulder.cn
Page 3 of 6
SAW FILTER
HDBF21101A24
3. TEST CIRCUIT
www.shoulder.cn
Tel:0755-82916880
Fax:0755-82916881
E-mail:info@shoulder.cn
Page 4 of 6
SAW FILTER
HDBF21101A24
4.DIMENSION
Dimension A B C D E H P
min 13.1 6.3 1.21
0.72
mm typ 13.3 6.5 1.36 1.5 0.8 0.76 2.54
max 13.5 6.7 1.51
0.80
Pin Configuration 11 Input 5 Output Other Ground
www.shoulder.cn
Tel:0755-82916880
Fax:0755-82916881
E-mail:info@shoulder.cn
Page 5 of 6
SAW FILTER
HDBF21101A24
5. ENVIRONMENTAL CHARACTERISTICS
5-1 Temperature cycling Subject the device to a low temperature of -40for 30 minutes. Following by a high temperature of +25 for 5 Minutes and a higher temperature of +85 for 30 Minutes. Then release the device into the room conditions for 1 to 2 hours prior to the measurement. It shall meet the specifications in table 1. 5-2 Resistance to solder heat Submerge the device terminals into the solder bath at 260 5 for 101 sec. Then release the device into the room conditions for 4 hours. It shall meet the specifications in table 1. 5-3 Solderability Submerge the device terminals into the solder bath at 245 5 for 5s, More than 95% area of the soldering pad must be covered with new solder. It shall meet the specifications in table 1. 5-4 Mechanical shock Drop the device randomly onto the concrete floor from the height of 1 m 3 times. the filter shall fulfill the specifications in table 1. 5-5 Vibration Subject the device to the vibration for 2 hour each in x,y and z axes with the amplitude of 1.5 mm at 10 to 55 hz. The filter shall fulfill the specifications in table 1.
6. REMARK
6.1 Static voltage Static voltage between signal load & ground may cause deterioration &destruction of the component. Please avoid static voltage. 6.2 Ultrasonic cleaning Ultrasonic vibration may cause deterioration & destruction of the component. Please avoid ultrasonic cleaning 6.3 Soldering Only leads of component may be soldered. Please avoid soldering another part of component.
www.shoulder.cn
Tel:0755-82916880
Fax:0755-82916881
E-mail:info@shoulder.cn
Page 6 of 6


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